An Automatic Position Recognition Technique for LSI Assembly
Proceedings of the Fifth International Joint Conference on Artificial Intelligence. Vision. Pages 685-692.
Abstract
A ·fully automatic LSI wire-bonding system utilizin g image processing techniques is described. The position recognition system developed is composed of measuring stations, a reco g nition device, a minicomputer, and cassette t a pe-recorders. The position of the bonding pad is found, generally in real-time, by the recognition device and computer. The computer calculates positional data of all bonding pads and s tores them on a cas s ette tape for a subsequent wire-bonding process. The position recognition me thods discussed are composed of a thresholding al g orithm and a position-finding algorithm. Th e se methods are evaluated from the viewpoint of thresholding stability, recognition rate and positional accuracy.
@inproceedings{ijcai1977p162,
title = {An Automatic Position Recognition Technique for LSI Assembly},
author = {Mese, Michihiro and Miyatake, Takafumi and Kashioka, Seiji and Ejiri, Masakazu and Yamazaki, Isamu and Hamada, Toshimitsu},
booktitle = {Proceedings of the Fifth International Joint Conference on
Artificial Intelligence, {IJCAI-77}},
publisher = {International Joint Conferences on Artificial Intelligence},
editor = {Raj Reddy},
pages = {685--692},
year = {1977},
note = {Vision},
url = {https://ijcai.org/proceedings/1977/162},
}
TY - CPAPER TI - An Automatic Position Recognition Technique for LSI Assembly AU - Mese, Michihiro AU - Miyatake, Takafumi AU - Kashioka, Seiji AU - Ejiri, Masakazu AU - Yamazaki, Isamu AU - Hamada, Toshimitsu T2 - Proceedings of the Fifth International Joint Conference on Artificial Intelligence, IJCAI-77 PB - International Joint Conferences on Artificial Intelligence PY - 1977 SP - 685 EP - 692 UR - https://ijcai.org/proceedings/1977/162 ER -Copied
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