Proceedings

An Automatic Position Recognition Technique for LSI Assembly

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Proceedings of the Fifth International Joint Conference on Artificial Intelligence. Vision. Pages 685-692.

Abstract

A ·fully automatic LSI wire-bonding system utilizin g image processing techniques is described. The position recognition system developed is composed of measuring stations, a reco g nition device, a minicomputer, and cassette t a pe-recorders. The position of the bonding pad is found, generally in real-time, by the recognition device and computer. The computer calculates positional data of all bonding pads and s tores them on a cas s ette tape for a subsequent wire-bonding process. The position recognition me thods discussed are composed of a thresholding al g orithm and a position-finding algorithm. Th e se methods are evaluated from the viewpoint of thresholding stability, recognition rate and positional accuracy.

Michihiro Mese, Takafumi Miyatake, Seiji Kashioka, Masakazu Ejiri, Isamu Yamazaki, and Toshimitsu Hamada. 1977. An Automatic Position Recognition Technique for LSI Assembly. In Proceedings of the Fifth International Joint Conference on Artificial Intelligence, IJCAI-77. IJCAI, 685–692. https://ijcai.org/proceedings/1977/162
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